Qualcomm and Huawei have signed a multi-year intellectual property agreement covering technologies related to 5G, computing, artificial intelligence and networking, according to the announcement.
The deal includes Qualcomm licensing technology linked to Huawei’s LogicFolding chip design approach. The system reorganizes circuitry and signal paths inside a chip to improve transistor density and data movement, offering an alternative way to boost performance as access to advanced manufacturing equipment becomes more restricted for Chinese companies.
Qualcomm will also acquire a group of Huawei’s US patents covering computing, AI, networking and other technologies. The companies did not disclose the value of the agreement or the specific patents involved. Huawei said the total value of its patent licensing contracts will exceed $6.9B once the new agreement is completed, a figure that does not represent the Qualcomm deal alone.
The agreement remains subject to regulatory approvals, including review by the US Federal Trade Commission under the Hart-Scott-Rodino Act. It does not restore Qualcomm’s previous role as a smartphone chip supplier to Huawei. Instead, the cooperation focuses on patents and licensing, while Huawei continues developing locally designed chips for smartphones, AI and data centers.
Source: Jawlah
